Technology for high precision, high speed and smooth wafer handling.
Bosch Rexroth wafer handling and wafer processing solutions are designed to perfectly balance high-dynamic servo drives, high-rigidity linear subsystems and pneumatic actuators – with high rigidity and no overshoot or backlash. This enables less idle time and standardized handling throughout your front-end operations. In addition, vibration is prevented by pre-defined algorithms in the motion control systems. And smoother motion sequences enable higher-order motion profiles and spline functions.