Wafer dicing

Modular motion solutions, open to third party actuators and sensors.

Bosch Rexroth’s modular high-speed, high-precision solutions are ideal for wafer dicing and wafer bonding. They seamlessly integrate all sensors and electric linear actuators, and avoid overshooting at the end position. Our back-end program covers the entire process flow from dicing and die bonding to pick-and-place.

Bosch Rexroth supports the full range of motors: servo, 2-phase stepper, voice coil and piezo, with power ratings ranging from several W to kW.